Abstract
The residual stress of epoxy resin for IC plastic packages generated in the curing process as well as the cooling processe is studied both analytically and experimentally. The property of thermal expansion in the temperature history and the viscoelastic properties at each temperature condition are measured by the strain gage method and creep test, respectively. The adhesive strength of the resin is determined by the axial-torsional loading test on tubular adhesive-bonded butt joints. With these mechanical properties, the mechanism of residual stress development is investigated using a 4-parameter viscoelastic model and a thermal shrinkage element. The residual stress is analyzed by the finite-element rnethed (F. E. M.) of a model of resin block which contains a metal plate, and the strength of the model is evaluated for the residual stress. The results of analysis show a tendency similar to experimental results and the critical position by the residual stress is found at the corner of the buried metal plate.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
