Abstract
The dynamics of electrochemical deposition and dissolution of copper in the presence of functionalized multiwalled carbon nanotubes in solution has been studied in detail using an electrochemical quartz crystal microbalance. Results demonstrate the central role of carbon nanotube functionalization on the values of mass and current densities of copper deposition. Amine functionalization increases competitive hydrogen evolution without significantly affecting the total amount of deposited copper, whereas carboxylic functionalization clearly enhances the deposition of larger amounts of smoother copper deposits. Molar mass analysis of deposited species reveals interactions of carbon nanotubes with the electrode surface dependent on the type of functionalization. The effect of carbon nanotube functionalization should be closely considered in the development of electrochemical strategies for the integration of carbon nanotubes in metallic copper.Graphical
Highlights
IntroductionCopper is key to numerous modern technologies because of its high electrical and thermal conductivity; a relentless increase in performance demand is fueling research into improving its properties in the electronic industry where the ampacity of copper is foreseen
Copper is key to numerous modern technologies because of its high electrical and thermal conductivity; a relentless increase in performance demand is fueling research into improving its properties in the electronic industry where the ampacity of copper is foreseen1 3 Vol.:(0123456789)Journal of Applied Electrochemistry (2019) 49:731–741 to limit the further miniaturization of microprocessors
Slow scan-rate cyclic voltammetry of gold electrochemical quartz crystal microbalance (EQCM) electrodes in acidic solutions of diluted CuSO4 highlights the effect of MWCNT functionalization on the dynamics of copper deposition and dissolution
Summary
Copper is key to numerous modern technologies because of its high electrical and thermal conductivity; a relentless increase in performance demand is fueling research into improving its properties in the electronic industry where the ampacity of copper is foreseen. Poly(acrylic acid) (PAAH) was used in the electrodeposition of Cu–MWCNT composite films achieving a maximum CNT loading of about 0.5 wt% [17, 18], whereas covalent followed by wrapping with poly(diallyldimethylammonium chloride) (PDDA) to obtain positively charged nanotubes was applied to produce composites with about 5 wt% CNTs [19]. Different experimental conditions such as CNT concentration in copper plating bath, temperature, potential, current density, are known to influence the deposition and CNT loading, less instead is known on the interaction between copper and modified CNT during deposition. We consider this new insight instrumental to a better understanding of the phenomena involved in the stages preliminary to the incorporation of CNTs in the copper matrix
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