Uncooled microbolometer system-level co-simulation using finite element analysis method and intellectual property core

Abstract

The purpose of system-level simulation is to find out a coordinated simulation method between the design of microbolometer and read-out integrated circuit (ROIC). Thermal capacity, thermal conductivity and resistance values of the model are obtained by finite element analysis (FEA). A equipment circuit of microbolometer which containing the parameters mentioned above is established. Then this equipment circuit is described by verilog-analog and mixed-eignal (AMS) language which is the reduced-order macro-model of microbolometer. This macro-model is compiled and defined as intellectual property (IP) core in cadence. System-level collaborative simulation between the IP core of microbolometer and ROIC was conducted, which established a direct link between the design of microbolometer and ROIC in the same design platform. The result of simulation is in agreement with experimental data. It can offer a fast and efficient ways of infrared focal plane array (IRFPA) design and fabrication, and reduce cost and shorten the development cycle for IRFPA industry.