Ultrasonic Vibration‐Assisted Microwire Electrochemical Discharge Machining

Abstract

The necessity for glass microstructure is rising as microelectromechanical systems (MEMSs) develop so quickly. Ultrasonic vibration is used in the microwire electrochemical discharge machining (WEDM) to attain superior quality of machining for glass microstructures. This means that by increasing the appropriate ultrasonic amplitude, the width of the gas film was decreased, lowering the critical voltage, and improving the machining stability. Then, a series of tests are performed using a micro helical electrode with 100 μm diameter to examine the influence of duty factor, ultrasonic amplitude, voltage, and frequency on the micro slit width. The investigational findings demonstrate that by including an appropriate ultrasonic amplitude and machining quality are greatly enhanced. The average slit width was decreased to 128.63 μm when the amplitude was 5.25 μm. Finally, using the ideal machining conditions, high-aspect ratio microcantilever and micro planar coil structures were successfully created on the glass plate. It has been demonstrated that microstructure with high-aspect ratio on brittle materials can be accomplished using ultrasonic vibration-assisted micro wire WEDM.