Abstract
Within the last few years, backside thinning of fully processed IC wafers has become a widely used technique in the search for high speed in advanced package technologies. Figure 1 shows the trend in finished IC thickness used in advanced packaging based on thickness figures quoted by various sources over the last ten years. The market potential for ultra-thin wafers, with backside metallization, is estimated by market researchers to be above 40% of the wafer market by the year 2010.
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