Abstract
AbstractThe purpose of this paper is to study the two dimensional deformation due to internal heat source in a microstretch thermoelastic solid with microtemperatures (MTSM). A mechanical force is applied along the interface of fluid half space and microstretch thermoelastic half space. The normal mode analysis has been applied to obtain the exact expressions for component of normal displacement, microtemperature, normal force stress, microstress tensor, heat flux moment tensor, and couple stress for MTSM. The effect of internal heat source, micropolarity, and microstretch on the above components has been depicted graphically.
Highlights
The dynamical interaction between the thermal and mechanical has great practical applications in modern aeronautics, astronautics, nuclear reactors, and high-energy particle accelerators
It helps us to study the effect of a heat source in the medium and the deformation caused in the medium due to the heat source
The normal mode analysis has been applied to obtain the exact expressions for component of normal displacement, microtemperature, normal force stress, microstress tensor, heat flux moment tensor, and couple stress for microstretch thermoelastic solid with microtemperatures (MTSM)
Summary
The dynamical interaction between the thermal and mechanical has great practical applications in modern aeronautics, astronautics, nuclear reactors, and high-energy particle accelerators. The author, Praveen Ailawalia working as a professor at M M University, Sadopur, Ambala, Haryana (India) is actively involved in the field of thermoelasticity, micropolar elasticity. He has 17 years of teaching experience in different Universities and institutions. The author has discussed deformation in thermoelastic medium and micropolar elastic medium in many of his research papers. The research problem discussed in the paper helps in analyzing the behavior of a medium with temperature changes if the medium undergoes deformation due to an internal heat source. The problem can be further discussed in case of mechanical sources applied on the free surface of the medium or along the interface of two different mediums
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