Abstract
The effects of transient thermal loads on the propagation of cracks in brittle substrate caused by the residual tension in a brittle film are studied using a finite element approach. Based on the assumption that cracks in homogeneous brittle solids seek a trajectory for which KII = 0, the results show how the crack trajectory change from transient growth to steady state depends upon the film thickness, the ratio of the elastic moduli of the film and substrate, the rate of application of the thermal load, and time.
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