Abstract
Abstract There is a growing need within the electronics industry for interconnect materials that can meet higher processing and operating temperatures. The solidus to liquidus range of current tin (Sn) based solders and other lead (Pb) solders are narrower than traditional SnPb solders as the industry is moving to higher temperatures. Transient Liquid Phase Sintering (TLPS) is a technology that offers low processing temperatures while having high temperature capabilities but has had limited exposure outside of the Semiconductor industry. Results of mechanical testing as well as product environmental data is presented herein as TLPS is used as a mechanical and electrical interconnect for Multi-Layer Ceramic Capacitors (MLCC).
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