Abstract
This paper presents new developments and perspectives in airborne and space phased arrays radars for the next generations of T/R modules (medium/long term), in order to decrease the mass production cost, while increasing the level of performance and reliability. In terms of physical architecture, even if the brick one is more current at mid-term, the tile concept is investigated for conformal and/or multifunction phased array antennas: a 3-dimension module will lead to a drastic reduction of size and weight of the antenna. MMICs are always the key components, with evolutions towards multifunction chips, new processes like GaN, MEMS power switches. Concerning the packaging, a technological roadmap indicates the different capabilities: thick film multilayer ceramic circuits, co-fired ceramics based on LTCC or HTCC processes, surface-mounted packages on printed circuits boards, collective wiring technology for high density integration and 3D architectures. The interconnection domain is also now more and more important in order to be compatible with the level of integration required for the microwave modules: fuzz buttons, flex, sub-miniature connectors. All these technologies mastered by Thales are dual for airborne and space modules, space developments benefiting from the quantities brought by airborne applications
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