Towards semi-insulating InGaAsP/InP layers by post-growth processing using Fe ion implantation and rapid thermal annealing

Abstract

In this paper, we report on an effective post-growth processing technique for developing semi-insulating (SI) photonic thin films absorbing in 1.3 µm. For that purpose, we examined a 1 µm thick unintentionally n-doped In0.72Ga0.28As0.61P0.39 epilayer (0.95 eV bandgap) modified by multiple-energy MeV Fe ion implantation. Fe was chosen as a deep-level impurity. The ion beam processing was performed at room temperature, followed by rapid thermal annealing (RTA) at 800 °C for 15 s. We investigated the impact of ion fluence on electrical properties by Hall effect measurements. Channelling Rutherford backscattering spectrometry, x-ray diffraction and photoluminescence measurements were carried out to evaluate crystal quality after each fabrication step. Beyond the onset of amorphization, when the total Fe fluence was more than 4.8 × 1013 cm−2, the implanted InGaAsP layer showed evidence of a poor recrystallization after RTA, and its isolation was impaired. Maximum resistivity values were achieved below the onset of amorphization where annealing reduced ion de-channelling and recovered damage-induced strain. With a total Fe fluence of 1.6 × 1013 cm−2, the electrical resistivity and Hall mobility reached values of 1.4 × 104 Ω cm and 4 × 102 cm2 V−1 s−1. These results add important insights on the optimization of this process for the development of InP-based SI photoconductive films.