Toward MXene interconnects

Abstract

Performance challenges as electronics continue to scale down motivate searches for new interconnect materials. In a recent report in Matter, Lipatov and coworkers demonstrate that MXene may be a candidate for interconnects by measuring conductivity and breakdown current density of Ti3C2Tx. Performance challenges as electronics continue to scale down motivate searches for new interconnect materials. In a recent report in Matter, Lipatov and coworkers demonstrate that MXene may be a candidate for interconnects by measuring conductivity and breakdown current density of Ti3C2Tx. High electrical conductivity and breakdown current density of individual monolayer Ti3C2Tx MXene flakesLipatov et al.MatterMarch 3, 2021In BriefAs the scaling down of integrated circuits continues, there is a growing interest in electrically conductive materials with high current-carrying capacity for the next generation of on-chip interconnects. Here, we report that monolayer Ti3C2Tx MXene, an emerging two-dimensional material, has a high breakdown current density of 1.2 × 108 A cm−2, which exceeds such properties of copper and other conventional metals. The remarkable combination of high electrical conductivity and high current-carrying capacity makes Ti3C2Tx promising for interconnect applications. Full-Text PDF