Abstract
Additive manufacturing and topology optimization algorithms have provided a springboard for heat sink development in novel cooling schemes. Here, phase change material (PCM) integrated heat sinks have been constructed using direct metal laser sintering (DMLS) of AlSi10Mg alloy in a two-tier design, incorporating topology optimized fin structures for conducting heat both to the PCM within the tier, as well as to the 2nd tier, where forced air cooling removes energy from the structure. As such, energy removal balancing can be achieved for ameliorating transient power spikes in an electronic package, while maintaining a lower fan power in the air channel. To validate this thermal performance, an experimental testbed was constructed to evaluate these multimode cooling heat sinks, under various heat dissipation and fan power conditions. Sugar alcohol PCMs are evaluated in this effort for passively absorbing a portion of the total heat load in an electronic package heater analog.
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