Abstract
In this paper, we present a conceptual design of an on-chip solder stack to connect silicon devices faster and more reliable. Almost all electric devices rely on solder layers to provide electrical and mechanical connections between components. We improve the solder connection at industry standard solder parameters of 300°C and some minutes of solder time. The solder stack is implemented as a transient liquid phase bonding (TLPB) system to realize interconnections. The creation of extremely thin layers accelerates the formation of intermetallic phases (IMPS) in solder processes. By using this effect. a dramatic increase in the diffusion dynamic can be achieved. We created the solder stack with Ficks’s law of diffusion using diffusion constants of copper and tin to deliberately form the phase Cu 3 Sn.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
