Abstract
As the request for high preferment and reliable 3D Integrated Circuit (IC) packages is increasing. Investigations in this technology are accelerating with the aim to reduce both cost and size. Glass interposer is recently used in this domain, it represents an effective alternative to the silicon due to its low cost, ease manufacturing and low electrical parasitic effects and cross talk. Although, the study of the reliability of the Through Glass Via (TGV) and its most critical stress areas remains a major concern. This study is about the thermal stress simulation in the glass interposer used in a three dimensional (3D) miniaturized camera package, in which we are using the Finite Element Analysis (FEA) method within ANSYS software to analyze the thermal stress concentration areas and inspect the geometric parameters effect on the resulting stress in a single TGV 3D model. Results are relevant to the boundary conditions and material properties used through all simulations. This work can be implemented to optimize via geometry and the whole glass interposer used in the 3D packaging technology.
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