Abstract
Three techniques of bond strength determination in micromechanical tests—fibre strain profile analysis by means of Raman spectroscopy, “kink” force determination in a traditional pull-out test, and crack length monitoring in a microbond test—were used for investigation of interfacial debonding in epoxy–glass fibre and epoxy–aramid fibre systems. Crack propagation was characterised by local interfacial parameters—critical energy release rate, Gic, and ultimate interfacial shear strength (IFSS), τult. The comparison of the results showed good agreement both between different techniques and between stress-based and energy-based failure criteria. Sizing of glass fibres caused more pronounced variations in the IFSS than for aramid fibres due to different interfacial failure patterns. The strength of “real” epoxy–glass composites with sized and unsized fibres correlates well with the bond strength determined from the micromechanical tests.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Composites Part A: Applied Science and Manufacturing
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
