Three dimensional shaping of ceramics by using CO2 laser and its optimum processing condition

Abstract

CO2 lasers have been widely used for 1- or 2-dimensional shaping, i.e., drilling, cutting and scribing ceramics. However, the method of 3-dimensional ceramics shaping has not been well established. The authors conducted a work on laser machining characteristics for silicon nitride and silicon carbide ceramics on various processing conditions. The relation between the removed volume and processing condition was functioned by the polynomial regression analysis which could be useful for prediction of the optimum processing condition. The major results obtained in this study are as follows; (1) The parameters on laser machining was experimentally studied,and their relations ware equated. (2) Laser machining is a excellent process on shaping ceramics, which enables crack free under suitable processing condition. (3) The mechanism of laser machining is different according to the processing material, which depends on evaporation mechanism. The mechanism and optimum processing ratio can be predicted from thermal properties. CO2 lasers have been widely used for 1- or 2-dimensional shaping, i.e., drilling, cutting and scribing ceramics. However, the method of 3-dimensional ceramics shaping has not been well established. The authors conducted a work on laser machining characteristics for silicon nitride and silicon carbide ceramics on various processing conditions. The relation between the removed volume and processing condition was functioned by the polynomial regression analysis which could be useful for prediction of the optimum processing condition. The major results obtained in this study are as follows; (1) The parameters on laser machining was experimentally studied,and their relations ware equated. (2) Laser machining is a excellent process on shaping ceramics, which enables crack free under suitable processing condition. (3) The mechanism of laser machining is different according to the processing material, which depends on evaporation mechanism. The mechanism and optimum processing ratio can be predicted from thermal...