Abstract
A thin-film technique for applying gold over tantalum-nitridecoated alumina substrates was developed to permit thermocompression bonding of fine wires, beam-lead devices, and lead frames. Satisfactory gold adhesion was obtained by depositing a thin layer of chromium over the tantalum nitride before depositing the gold. The system provides guidelines for fabricating hybrid microcircuits that contain beam-lead devices. (auth)
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