Abstract
Devices of thin film in the high-Tc superconductor are subjected to thermoelastic loads because they are processed in high temperature and operated in cryogenic temperature. Serious problems exist in the reliability of the devices due to thermal stresses. In this study, the stress distribution and singularity near the edge of the interface between a thin film and its substrate are discussed by thermoelastic analysis. A boundary element method using fundamental solution of dissimilar materials is extended to the thermoelastic problem. The stress distribution near the edge of the interface can be calculated with high accuracy, because there is no boundary integral terms at the interface. The singular stress field near the edge of the interface is also obtained.
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