Abstract
We report on thermal and mechanical analysis of uncooled antenna-coupled La0.67Sr0.33MnO3 microbolometer made on circular SOI (Silicon On Insulator) membrane with no limitation in its active area (circular membrane with diameter up to 2 500μm). A simple method how to investigate the thermal conversion efficiency (thermal resistance value - Rth) is introduced. Thermal analysis is supported by the ANSYS modelling and simulation. It is found that Rth and thermal time constant (τ) of our LSMO microbolometer (bolometer sensitivity and time response) can be tuned by the SOI membrane thickness. Rth value as high as 188K/mW and τ value as low as 0.88ms are estimated from the thermal simulation for SOI membrane with total thickness of 300nm (SiO2-200nm, Si-100nm). Genesis of the induced mechanical stress changes after main processing steps is found and evaluated to explain the mechanical stability of the LSMO based MEMS microbolometer.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
