Abstract
Two limiting factors exist for the monolithic integration of semiconductor sensors and electronic circuits: the yield and the self-heating. In this paper, the thermal behaviour of monolithically-integrated silicon transducers with thin membranes is analysed. The mathematical solution of the heat-conduction equation under these special conditions is carried out by the finite difference method. The influence of various parameters on the thermal behaviour is discussed. Some examples of appropriate thermal designs for integrated digital pressure sensor chips are given.
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