Abstract
The criterion and the corresponding approach for the thermal placement of integrated circuits (IC) elements on the crystal surface are proposed. The criterion of placement is identical to the traditional criteria of minimizing the total length of connections between elements, which at the placement stage enables to apply an additive multiparametric criterion of joint consideration of electrical and thermal modes for operating of the IC elements.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: Journal of Contemporary Physics (Armenian Academy of Sciences)
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.