Abstract
As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.
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