Abstract

Micro-plasma transferred arc (μ-PTA) deposition process is a recently developed material and energy efficient additive layer manufacturing process for metallic deposition which is capable of bridging the gap between capabilities of high energy based and conventional arc-based deposition processes. Development of model of deposition geometry is essential to study the relationship and influence of various process parameters on the deposition geometry parameters. This paper reports development of a thermal model to predict single track deposition width and height in terms of three important process parameters of μ-PTA deposition process (i.e. input power, volumetric deposition rate and travel speed of worktable) using fundamental principles of energy balance and heat transfer. The developed model was validated by comparing the model predicted results with the experimental results of single track deposition geometries corresponding to various parametric combinations in the μ-PTA deposition process. The predicted values were found in very good agreement with the experimental results thus validating the developed models. The developed model has wide applicability because it depends only on thermal properties of the substrate and deposition materials and is independent of form of the deposition material therefore it can be used for predicting deposition geometry for any combination of substrate and deposition materials and for any form of the deposition material.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.