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  • Thermal Management of Electronic Devices Using Lotus-Type Porous Copper: From Air Cooling to Two-Phase Immersion Cooling
  • https://doi.org/10.5104/jiep.28.466Copy DOI Icon

Thermal Management of Electronic Devices Using Lotus-Type Porous Copper: From Air Cooling to Two-Phase Immersion Cooling

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Thermal Management of Electronic Devices Using Lotus-Type Porous Copper: From Air Cooling to Two-Phase Immersion Cooling

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