Abstract
An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < d/ D < 0.97) were studied through a simulation modeling. The use of ratio d/ D = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to d/ D. Stress of pin varied quadratically with the d/ D. The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.
Highlights
Simulation analysis plays a significant role in engineering applications, such as in the modeling of biomechanical devices, aircraft structures, automotive components, and microelectronic devices
This study focuses on thermal fluid-structure interaction (FSI) analysis in the wave soldering process
The solder profile through printed circuit board (PCB) is validated by the experimental result, demonstrating the excellent capability of the proposed method in solving thermal FSI in wave soldering
Summary
Simulation analysis plays a significant role in engineering applications, such as in the modeling of biomechanical devices, aircraft structures, automotive components, and microelectronic devices. The rapid development of simulation modeling facilitates predictions on real situations. It is beneficial in small-scale and complex geometry. Simulation modeling has several applications in electronic packaging, such as integrated circuit (IC) encapsulation [1], fluid-structure interaction (FSI) in molded underfill [2], wire sweep analysis [3], thermal coupling method on ball grid array package reflow soldering [4], and flexible printed circuit board (PCB) [5]. Multiphysics simulation modeling is important to model and solve any phenomenon that involves fluid-thermal and fluid-structural interactions. To solve the multiphysics problem, a coupled simulation is required that enables the simultaneous analysis of either fluid-structure or thermal-structure process.
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