Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials

Abstract

A lot of practice had proved that the failure rate can be used as the reliability indicators of MCM (Multi-Chip Module). The lower the junction temperature of the semiconductor integrated circuit device in MCM, the lower the failure rate of components was, thus the higher the reliability of MCM. Therefore, in order to measure the junction temperature of the semiconductor components of MCM, computer simulation is needed in the stage of design，which was essential for improving the reliability of MCM’s encapsulation and even the whole electronic machine system. In this paper, we tried to thermal design the high-power heating devices-MCM of the multi-functional electronic devices. First, the cooling principles of MCM encapsulation were introduced. And then based on the design principles and precautions of MCM, we designed an MCM encapsulation for cooling analyses of ANSYS. The results of finite element analyses showed the reasonableness of the design of MCM, and combined with the different substrate materials and circuit board materials, further discusses about improved cooling capability of MCM were expressed in this paper. At last, we got the desired effect.