Abstract
Abstract In the reinforcing of structures or the patching of cracks with a bonded overlay of high strength composite material, the thermal mismatch between the composite patch and the underlying material is often thought to be a major problem. This paper shows that the temperature fields used in the repair process together with the support conditions cause a significant lowering of the effective coefficient of expansion in the structure which is being repaired, which in turn results in low values for the residual thermal stresses.
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