Abstract

AbstractHigh strength polyethylene fiber (Toyobo, Dyneema® fiber, hereinafter abbreviated to DF) used as reinforcement of fiber‐reinforced plastics for cryogenic use has a high thermal conductivity. To understand the thermal conductivity of DF, the relation between fiber structure and thermal conductivity of several kinds of polyethylene fibers having different modulus from 15 to 134 GPa (hereinafter abbreviated to DFs) was investigated. The mechanical series‐parallel model composed of crystal and amorphous was applied to DFs for thermal conductivity. This mechanical model was obtained by crystallinity and crystal orientation angle measured by solid state NMR and X‐ray. Thermal conductivity of DF in fiber direction was dominated by that of the continuous crystal region. The thermal conductivity of the continuous crystal part estimated by the mechanical model increases from 16 to 900 mw/cmK by the increasing temperature from 10 to 150K, and thermal diffusivity of the continuous crystal part was estimated to about 100 mm2/s, which is almost temperature independent. The phonon mean free path of the continuous crystal region of DF obtained by thermal diffusivity is almost temperature independent and its value about 200 Å. With the aforementioned, the mechanical series‐parallel model composed of crystal and amorphous regions could be applied to DFs for thermal conductivity. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1495–1503, 2005

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.