Abstract
As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is a kind of thermal conductive material, with silicon oil. In addition, copper powder was mixed with graphene and alumina, respectively, and the thermal conductivity performance was compared. As a result, the thermal conductivity improved by 4.5 W/m·k over the silicon base, and the upward trend of thermal conductivity increased steadily up to 15 vol. %, and the increasing trend decreased after 20 vol. %. In addition, the increased rate of thermal conductivity from 0 to 5 vol. % and 10 to 15 vol. % was the largest.
Highlights
As electronics and motherboards become smaller, the power consumption required increases significantly, resulting in a sharp increase in emission power density [1,2,3], This increase in power density is associated with the internal thermal characteristics of the device, which is directly related to the performance and efficiency of the electronic device [4,5,6]
It can be observed that the thermal conductivity of the thermal grease increases as the volume percentage of the copper particles increases
It can be observed that the thermal conductivity of the thermal grease mixed with copper particles of large and small hybrid size increases with an increase in volume percentage of the small
Summary
As electronics and motherboards become smaller, the power consumption required increases significantly, resulting in a sharp increase in emission power density [1,2,3], This increase in power density is associated with the internal thermal characteristics of the device, which is directly related to the performance and efficiency of the electronic device [4,5,6]. In order to control heat dissipation characteristics of electronic products with heat generation, a heat conductive material (TIMs: Thermal Interface Materials) is used to reduce heat resistance due to surface roughness and to improve a contact area between the device and the heat sink [8]. An ideal model of this thermal conductive material is applied between the heat sink and the device to remove the air layer present at the interface in order to improve the contact area, reducing the thermal contact resistance and enhancing smooth heat transfer. Silicone is generally used as a base material of thermal grease due to its excellent thermal stability and relatively easy processing [17,18,19] Ceramic fillers such as copper, which are thermally conductive and electrically resistant, are utilized [20,21,22]. The purpose of this study is to investigate the thermal conductivity performance of the copper powder
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