Abstract
Cu-coated powder was fabricated by electroless plating process and SiCp-reinforced copper matrix composites with the reinforcement content of 30—50 vol.% were fabricated by hot pressing process using Cu-coated and uncoated SiC powders, respectively. Also, the microstructure and thermal conducting property of the composites were studied. The results showed that with the increase of SiCp particle size, the thermal conductivity (TC) of the composites also increased. Also, the oxides in the composites obviously decreased the TC of the composites. The thermal conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provides important data for the application of SiCp/Cu composites as electronic packaging materials in the near future.
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