Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film

Abstract

Thermal and hygroscopic reliability of anisotropic conductive film (ACF) joints in relation to flip-chip bonding force was evaluated by thermal shock and constant temperature/humidity testing. The failure mode by thermal shock testing varied with increasing bonding force, i.e., (1) formation of a conduction gap between conductive particles and Au bump or Ni/Au plated Cu pad at low bonding force and (2) delamination of adhesive matrix from the plated Cu pad on the flexible substrate at high bonding force. The delamination initiated as a crack under a conductive particle and propagated sideward resulting in a complete delamination of the ACF from the Cu pad. However, delamination was observed between the ACF and Au bump on the chip side after the constant temperature/humidity testing for 500 h. A theoretical calculation was also conducted to predict the connection resistance of the ACF joint before and after reliability tests. The calculation showed the importance of the bonding gap between the electrodes.