Abstract
The current research on the removal mechanism of ultra-precision polishing lacks various microscopic understandings of material removal and the process of surface material migration, which hinders the development of ultra-precision polishing technology, especially field constrained abrasive polishing. In order to clarify effects of abrasives at the atomic level on material removal in the field constrained abrasive polishing, a three-dimensional molecular dynamics model is conducted to study the mechanics of ultra-precision polishing on an aluminum (Al) specimen with a diamond abrasive. In order to simulate the real polishing environment, a double abrasive polishing system is designed. The mechanism of material removal was studied by observing the surface topography, surface damage, and coordination number of the working area during polishing. The influence factors of material removal were also investigated by changing the initial velocity, incidence angle, initial force, and relative position of the double abrasives. The results show that the transverse distance and the longitudinal distance between the double abrasives make a slight difference to the number of phase transformation atoms in the double abrasive polishing system, which is directly proportional to the initial velocity, the initial force, the distance between the specimen and its closest abrasive in the Z direction, and the distance between the double abrasives in the Z direction and inversely proportional to the incident angle of the double abrasives. Finally, it is found that the force on the abrasives is the main factor that determines the removal efficiency of the field constrained abrasive polishing.
Highlights
In recent years, the demand for polishing materials with higher planarity and nanometric surface finish has grown tremendously.1 In order to overcome the defects such as the easy wear of a traditional grinding head2 and uneven roughness of the specimen surface,3,4 it is necessary to change the traditional contact polishing method of fixed abrasives and find a non-contact ultra-precision polishing method
The first part is to study the mechanism of material removal by observing the surface topography, surface damage, and coordination number of the impact area during the polishing process, where the initial velocity is 100 m/s, the incident angle is 45○, the initial force is 4 × 10−11 N, and the values of W, L, H, and M are 12 Å, 8 Å, 20 Å, and 20 Å, respectively
By means of establishing the model of the double abrasive polishing system, the process and mechanism of material removal in the field constrained abrasive polishing under microscopic conditions were investigated from the perspective of surface topography, surface damage formation process, and coordination number
Summary
The demand for polishing materials with higher planarity and nanometric surface finish has grown tremendously. In order to overcome the defects such as the easy wear of a traditional grinding head and uneven roughness of the specimen surface, it is necessary to change the traditional contact polishing method of fixed abrasives and find a non-contact ultra-precision polishing method. The MD simulation research studies above are to study the material removal through the scratches of the abrasive on the specimen; in field constrained abrasive polishing, it is more reasonable to analyze the removal mechanism of material by using abrasives to hit than to scratch the specimen This is because the abrasive during polishing is mostly distributed in the polishing fluid and only a small part is attached to the surface of the specimen. Different from the previous single abrasive scratch on the workpiece, the abrasive impact method enriches the research means of material migration on the workpiece surface, which is suitable for the study of various micro-polishing mechanisms. The influencing factors of material removal are explored by changing the initial velocity, incident angle, initial force, and relative position of the double abrasives
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