Abstract
We propose complementary solutions to improve the evaluation of PCB under specific stresses using electrical and physical indicators adapted to a given part of the board. For ceramic capacitors, the residual piezoelectricity provides an impedance signature at resonance allowing detection of local physical defects. Solder joint fatigue criticity under a thermal cycle can be predicted using combined analytical and FEM simulations, while the lead phases coarsening provides a good early degradation indicator. Finally, the ball inspection of BGA packages using shear waves in scanning acoustic microscope lead to an interesting improvement of resolution.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
