Abstract
An analytical expression is developed to predict the thermal residual stress redistribution in a passivated bamboo interconnect based on the coupling of the grain boundary diffusion with the interconnect-passivation interface diffusion. Quantitative results show that the thermal stress redistribution in the interconnect depends strongly on the microstructure of the interconnect, the initial state of the thermal residual stress and the diffusivity ratio of the grain boundary to the interface.
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