Abstract

Micro-electromechanical systems (MEMS) safety-and-arming (S&A) device shows great potential in munition miniaturization, and it can be seen as the symbol of the fourth generation of weapons systems. In this paper, the design, fabrication, and actuation performance of a silicon based S&A device is presented. It is a multilayer stacked device, which is composed of the cover plate, the actuation chip, and the barrel plate. The electro-thermal principle is investigated in MEMS scale. With 11 V driving voltages, the structure of V-shape actuator, pawl, and slider can generate 100 μm and 45 μm displacement, and realize pulling, disengaging, and reengaging to change the device from the safety position into armed position smoothly (550 μm displacement). The rack and interlock mechanism formed by the pawl and slider gives the device the features of linear output displacement, low power consumption, input signal recognition, and sustained displacement. The 20,000 g setback acceleration is applied, and no structure damage can be found after the impact, which indicates the good anti-load ability of the MEMS S&A device. In order to solve the contradiction between the functional structure and the fabrication process, different structures are designed separately on different wafers. Both silicon and SOI wafers are used in the fabrication process, and the S&A device has been minimized into 8.5 mm × 8.5 mm × 0.8 mm successfully.

Highlights

  • Micro-pyrotechnics refers to a new generation of pyrotechnics, which is integrated with energetic material and a micro ignitor

  • The traditional Safety-and-Arming (S&A) device can hardly meet the demand of system miniaturization, while micro-electromechanical systems (MEMS) technology shows a tremendous potential and has been explored in this field recently [1,2]

  • Three main methods can be found to achieve the fabrication of a MEMS S&A device

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Summary

Introduction

Micro-pyrotechnics refers to a new generation of pyrotechnics, which is integrated with energetic material and a micro ignitor. The first way is the (Lithographie, Galvanoformung and Abformung) (LIGA) method, which is based on metal substrates [3,4]. In this method, a MEMS metal spring and slide are needed. A MEMS metal spring and slide are needed These structures are set perpendicular to each other to form an interlock mechanism. Some researchers used electroplate to replace LIGA [5,6], the large structure size and low fabrication precision still limits the development of device miniaturization. The air thermal conductivity kV is the material property, which means the MpaicrraommaechtienresR20T19is, 1m0, xainly based on the structure size tV.

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