Abstract
Abstract 5th Generation Telecommunications Technology, 5G, is emerging to provide the market with even higher data rates and bandwidth and lower response times than the 4th generation telecommunications technology, 4G/LTE, that is currently deployed. With commercial 5G networks coming on-line in 2020 the network providers and infrastructure companies are quickly developing devices and systems to meet the demand of the 5G market. Since high data rates and high bandwidths demand high frequency microwave, MW, devices, Low-Temperature Co-fired Ceramic, LTCC, is one of the materials of choice for those modules in a 5G system that require the high 3D integration, high signal integrity, high reliability and high power performance of LTCC. LTCC has proven for more than two decades now to exhibit these qualities in high-frequency telecommunication applications. This paper explores the relevance of LTCC technology in the module packaging market in the 5G market.
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