The relationship of life prediction between cyclic bending and thermal cycle testing on CSP package

Abstract

With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered a good candidate in this study. The 4-point cyclic bending condition including different bending frequency and displacement to simulate actual service condition is defined in JEDEC22-B113[1].