Abstract
The reduction of copper oxide thin films by a hydrogen plasma generated by an atmospheric-pressure glow (APG) discharge was investigated. The copper oxide films were prepared by heating the sputtered copper films to C in the air (heat-formed copper oxide) or by sputtering (sputtered copper oxide). Both films were composed of . The reduction occurs first on the surface, then the interface gradually shifts from the surface into the inner region and finally the whole layer is reduced to metallic copper. This process is approximately explained by assuming that the diffusion of the atomic hydrogen in the reduced layer is the rate-deyermining step. By transmission electron microscopic (TEM) observation, a layer of 3 - 5 nm thickness composed of many microcrystals was observed along the surface of the heat-formed copper oxide. After the APG hydrogen plasma treatment, the crystal layer disappeared and the crystalline lattice was re-arranged to form large crystal Cu grains.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
