Abstract
AbstractThe quantitative adhesion of electrodeposited nickel to a range of aluminium alloys, prepared by etching in a nitric-hydrofluoric acid mixture and subsequently treated in a sodium zincate solution, has been examined. A standard method has been devised which will yield adhesion in excess of the ultimate tensile strength for most alloys; a slight variation is necessary for high magnesium or silicon alloys, on which the adhesion, although high, is slightly less than the tensile strength. A hypothesis on the theory of the process is advanced. An appendix on quantitative adhesion testing is of general application.
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