The performance of compact thermal models for LED package

Abstract

A method for creating compact thermal models of single-chip and multi-chip LED package is developed and evaluated with good agreement between the finite volume simulation and experimental data. The different compact thermal models for LED package are checked against detail model under 38 boundary conditions. The junction temperature predictions from the single-thermal-resistance model are within 16% for all boundary conditions. And the star-thermal-resistance model gives the most consistent and accurate prediction for the junction temperature, within 5% for all boundary conditions. Based on creating star-thermal-resistance model of single-chip LED package, the compact thermal model of multi-chip LED package is established, in which interacting thermal resistance is taken into account because of the thermal coupling effect between the chips.