Abstract
The morphology and growing behavior of Cu6Sn5intermetallic compound (IMC) of low Ag content Sn-2.5Ag-0.7Cu-0.1RE/Cu solder joint interface are investigated by adopting the X-ray diffraction, JSM-5610LV scanning electronic microscope and energy spectrum analysis. The results show that the cross-section morphology Cu6Sn5of the solder joint interface is scallop-like and its section morphology is circle-like grain. With the aging time increasing, the cross-section Cu6Sn5morphology of the solder joint interface can be changed from the scallop-like to the shape-layer, and the growing kinetics is coincidence with the law of parabola and its growing behavior is controlled by diffusion. With adding a small amount of rare earth elements in the Sn-2.5Ag-0.7Cu solder alloy, the growing rate of the Cu6Sn5can be reduced.
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