Abstract
An investigation is presented of the influence of post-bond heat treatment on microstructural development in transient liquid phase bonds between L10 martensite-forming Ni-24 at% Al-16 at% Cr and nominally stoichiometric NiTi which transforms to monoclinic (distorted B19 type) martensite. The joints discussed in this article were prepared using 50 μm thick commercial purity copper (99.8 wt% Cu) interlayers and were bonded at 1150°C for 1 h. The resulting bonds were post-bond heat treated at 1000°C for times varying between 4 and 12 h and then characterized by edge-on transmission electron microscopy.
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