Abstract
Bilayer and monolayer coatings offer good protection against metal and alloy corrosion. The protection of copper against corrosion via the use of metallic and polymeric coatings has been the subject of considerable research in the last decade. In this study, ZnNi plating was successfully deposited on the Cu electrode applying current of 7 mA with chronopotentiometry technique in the acidic solution. The PPy film was synthesized on thin ZnNi plating which deposited electrochemically on the copper surface. Homopolymer film was achieved using cyclic voltammetry technique in sodium oxalate solution containing pyrrole monomer. PPy coating provided a significant barrier property due to its lower permeability as well as the improvement the barrier behavior in time.
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