Abstract

The anodic dissolution of chalcopyrite in ammoniacal solutions was investigated using electrochemical methods. At low overvoltages, the formation of a copper deficient sulfide layer, Cu1-xFeS2 through a charge transfer reaction is proposed based upon the dependence of the rest or open circuit potential on solution composition and the presence of a Tafel region of appropriate slope. In addition, a current peak that occurs at 10−4 A/cm2 is a function of the square root of the voltage scanning speed and is explained in terms of a charge transfer reaction. At larger overvoltages, constant potential experiments and mass balances performed at various anodic potentials indicate that the dissolution is consistent with the overall reaction, CuFeS2 + 4NH3 + 9OH- = Cu(NH3)4+2 + Fe(OH)3 + S2O3= + 3H2O +9e-, although some copper may be released to solution in the cuprous state and some ferrous iron has been identified in the product film. Currentvs time data taken during constant potential experiments were found to obey a linear rate relationship. This was interpreted in terms of the formation of a layer of constant thickness which is corroded at the outer interface at the same rate it is formed at the inner interface.. The model proposed is typical of the corrosion of some metals. An examination of the polarization curves shows the dissolution reaction to be first order with respect to [OH-]. The lack of dependence on [Cu2+] indicates that the catalytic effect of cupric ion during oxygen pressure leaching is related only to the cathodic reduction of O2 in agreement with the results of previous investigations.

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