Abstract
In order to obtain the effect of solder joint height on the interface diffusion in micro solder joints. The Cu/Sn3.0Ag0.5Cu(SAC305)/Cu solder joints of the same volume and different heights were taken as research objects. The growth and evolution law of the intermetallic compound in three heights solder joints was studied after solid–liquid diffusion, and the influence of solder joint height on element diffusion at solid–liquid interface was obtained. The results show that the element diffusion coefficient increases with the solder joint height during reflow welding, and decreases with the solder joint height during thermal aging.
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