Abstract
Abstract This column describes the structure and process being followed by the councils working on the Failure Analysis Technology Roadmap at the direction of the EDFAS Board. The FA Roadmap activity was recently restructured to establish three Councils: Die-Level Roadmap Council (DLRC), Package Innovation Roadmap Council (PIRC), and an FA Future Roadmap Council (FAFRC). To incorporate a common FA workflow, the DLRC will host two separate domain teams: Isolation and Post-Isolation Domain. The column describes the FA Roadmap work conducted at the ISTFA 2022 Conference and activities planned for 2023.
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