Abstract
A major issue with copper metallization is the diffusion and/or dissolution of copper into polymers used as insulating dielectric layers in microelectronic devices. Polymers are typically deposited by spin-coating. But when substrate-polymer interactions are studied, the process by which the polymer is deposited must be carefully considered. For example, what roles do the solvent or the curing conditions play in bringing copper into the polymer film? In this study, we focus on a frequently neglected aspect of the problem – that of solvent interactions with the copper. We have examined the ability of commonly used solvents to dissolve copper under oxygen atmospheres. For this study, copper turnings were stirred with the pure solvent under O 2. The presence of copper in solution was determined with spot tests, and solid reaction products were characterized with X-ray powder diffraction. Copper was found to dissolve in 1-methyl-2-pyrrolidinone, anisole, methylisobutylketone, propylene glycol methyl ether acetate, γ-butyrolactone, dimethylacetamide, water, methylmethacrylate, m-cresol, and sulfolane in the presence of oxygen, but not in toluene, chlorobenzene, 0-dichlorobenzene, chloroform, acetone, ethylacetate and tetrahydrofuran.
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