Abstract
In this study the DMAIC (Define, Measure, Analyse, Improve and Control) technique is applied at a company producing Flexible Printed Circuit Board (FPCB) in Malaysia. It is an initiative for continuous improvement by the company. The aim of the study is to reduce the number of open defects during the production of the single sided FPCB which has substantial impact on the profit margin of the company. The study examines one of the production line which has the highest defect rate. The study has utilised the Six Sigma tools such as brainstorming, process mapping, fish bone diagram, Pareto chart and control charts. From the analysis, it is found that the major contributor to the open defect problems are contamination of the separator during production. The causes of the contamination were identified and action plans were implemented. These actions have resulted in an overall reduction of defect rate and cost saving for the company. For the duration of the study, the overall defect rate for the particular line was reduced from 0.6% to 0.37% with a total saving of RM 1423.60. The case study showed that DMAIC process is an effective approach that can solve what seems to be a major problems using simple solutions. If conducted properly and efficiently, it has the potential to give good returns to the company.
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