Abstract
Secondary electron emission (SEE) inhibition and vacuum instability are two important issues in accelerators that may induce multiple effects in accelerators, such as power loss and beam lifetime reduction. In order to mitigate SEE and maintain high vacuum simultaneously, open-cell copper metal foam (OCMF) substrates with Ti-Zr-V-Hf non-evaporable getter (NEG) coatings are first proposed, and the properties of surface morphology, surface chemistry and secondary electron yield (SEY) were analyzed for the first time. According to the experimental results tested at 25 °C, the maximum SEY () of OCMF before and after Ti-Zr-V-Hf NEG film deposition were 1.25 and 1.22, respectively. The XPS spectra indicated chemical state changes of the metal elements (Ti, Zr, V and Hf) of the Ti-Zr-V-Hf NEG films after heating, suggesting that the NEG films can be activated after heating and used as getter pumps.
Highlights
The open-cell copper metal foam (OCMF) material was first proposed in this paper to inhibit the Secondary electron emission (SEE) in accelerators or vacuum devices, etc
Ti-zirconium oxideindicates (Zr)-V-Hf non-evaporable getter (NEG) films were deposited on OCMF substrates for the first time to improve the pumping properties in a vacuum system
The Secondary electron yield (SEY) of the OCMF substrates before and after Ti-Zr-V-Hf NEG film deposition were evaluated by the SEY measurements
Summary
For the search of possible dark matter (DM) and the study of Higgs physics, several high-energy and high-luminosity accelerators such as the future circular collider (FCC) and the super proton–proton collider (SPPC) have been proposed, with their vacuum systems facing two main challenges of high vacuum gradient and the electron cloud (EC) issues. To further improve the residual gas absorption capacity of the film, porous metal substrates with a high contact surface area can be used. With the advantage of porous structures, foam materials can be used as supports for composites by providing a large contact area for the fillers. Leong et al introduced and optimized the pore density of aluminum foams to further improve heat transfer in electronic systems, taking advantage of the high thermal conductivity and large contact surface area of metal foams [29]. The structural properties, secondary electron yields (SEYs) and activation process of Ti-Zr-V-Hf NEG films with OCMF substrates were investigated for the first time
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