Abstract
We present a comparative computational study of temperature-dependent elastic constants of silicon (Si), silicon carbide (SiC) and diamond as substrates that are commonly used in the manufacture of Micro-Electromechanical Systems (MEMS) devices. Also mentioned is Cd2SnO4, whose ground-state elastic constants were determined just recently for the first time. Si is the dominant substrate used in the manufacture of MEMS devices, owing to its desirable electrical, electronic, thermal and mechanical properties. However, its low hardness, brittleness and inability to work under harsh environment such as high-temperature environment, has limited its use in the manufacture of MEMS like mechanical sensors and bioMEMS. Mechanical sensors are fabricated on SiC and diamond due to their high Young’s moduli as well as high fracture strength, while the bioMEMS are fabricated on polymers. The effect of temperature on the elastic constants of these substrates will help in giving insight into how their performance vary with temperature.
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